Dr. Samrina Sahir

samrina.sahir@fcm3.paf-iast.edu.pk

Dr. Samrina Sahir

Assistant Professor

Biography

Dr. Samrina Sahir completed her Bachelor’s degree in Metallurgical and Materials Engineering from the University of Engineering and Technology, Lahore. She was selected for a five year MS leading to PhD program Under HRDI-UESTP HEC Scholarship (2017-2022). In this scholarship program she has worked on the interaction of ceria particles with oxide and PVA brush during the CMP process under the supervision of Prof. Jin-Goo Park at Hanyang University, South Korea. Her doctoral research work was on the consumables of chemical mechanical planarization processes involved in semiconductor processing. She has a vast experience on several material characterization techniques using Field Emission Scanning Electron Microscope, Zeta-potential and Particle Size Analyzer, Optical Reflectometer, Four-Point Probe, Optical Microscopy, Fourier Transformation Infrared Spectroscopy (FTIR), Contact Angle Analyzer, Electrochemical Analysis using Potentiostat and UV-Vis Spectrometer.

She has been indulged in advanced materials research in the field of materials science and engineering since 2017. Her areas of research include processes involved in manufacturing semiconductor devices such as Chemical Mechanical Planarization (Metal and STI CMP), post CMP cleaning involving brush scrubbing, megasonic cleaning, and chemical cleaning processes for CMP residues removal, and investigation of abrasives nature and properties used in CMP.

She has published numerous research papers in international journals of repute with high impact factors and citations. Also, she has presented her research work in several renowned international conferences in Europe, USA, Japan, Taiwan and South Korea.

Education

  • Ph.D (Materials Science & Chemical Engineering) Hanyang University (HYU), South Korea. 2022
  • MS (Materials Science & Chemical Engineering), Hanyang University (HYU), South Korea. (2019)
  • BSc (Metallurgical and Materials Engineering), UET Lahore. (2014)

Professional Experience

  • IPFP Fellow (Department of Materials Science and Engineering) Aug-2023
  • Assistant Manager, Technology Department, HMC Taxila (June 2015 to August 2017).

Publications

08 International Publications in ISI indexed journals, impact factor of 32, citations 86, h-index 5:

  • Effect of slurry particles on PVA brush contamination during post CMP cleaning. Samrina Sahir , H. W. Cho, P. Jalalzai , S. Samanta , S. Hamada, T.-G. Kim, and J. G. Park. Materials Science in Semiconductor Processing, 151 (2022) 107043. https://doi.org/10.1016/j.mssp.2022.107043 (Impact: 4.64).
  • Effect of Skin Layer on Brush Loading, Cross Contamination, and Cleaning Performance during Post CMP Cleaning. Samrina Sahir, H W. Cho, P. Jalalzai , P. Jerome, R. Singh, S. Hamada, T.-G. Kim, and J. G. Park. ECS Journal of Solid State Science and Technology, 11 (2022) 054003. DOI: 10.1149/2162 8777/ac6979 (Imapct: 2.483).
  • Study on PVA Brush Loading and Conditioning during Shallow Trench Isolation Post CMP Cleaning Process. Samrina Sahir, H. W. Cho, N. P. Yerriboina, T.-G. Kim, S. Hamada and J. G. Park. ECS Journal of Solid State Science and Technology, 11 (2022) 024004. DOI: 10.1149/2162 8777/ac5166 (Impact: 2.483)
  • Effect of Slurry Additives on Co BTA Complex Stability and Inhibition Property During Co CMP Process. P. Jalalzai, H. Y. Ryu, Samrina Sahir, R. P. Meethal, S. Hamada, T.-G. Kim and J. G. Park. ECS Journal of Solid State Science and Technology, 11 (2022) 084006. DOI: 10.1149/2162 8777/ac8833 (Impact: 2.483)
  • Investigation of the effect of different cleaning forces on Ce O Si bonding during oxide post CMP cleaning. Samrina Sahir, N. P. Yerriboina, S. Y. Han, K. M. Han, T.-.G Kim, N. Mahadev, J. G. Park. Applied Surface Science, 545 (2021) 149035. https://doi.org/10.1016 /j.apsusc.2021.149035 (Impact: 7.392)
  • Mechanisms of colloidal ceria contamination and cleaning during oxide post CMP cleaning. Samrina Sahir, N. P. Yerriboina, S.-Y. Han, T.-G Kim, N. Mahadev, J. G. Park. Microelectronic Engineering, 241 (2021) 111544. https://doi.org/10.1016/j.mee.2021.111544 (Impact: 2.662)
  • Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers. M. K. Poddar, P. Jalalzai, Samrina Sahir, N. P. Yerriboina, T.-G. Kim and J. G. Park. Applied Surface Science, 537 (2021) 147862. https://doi.org/10.1016/j.apsusc.2020.147862 (Impact: 7.392)
  • Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process, K.-M. Han, S.-Y. Han, Samrina Sahir, N. P. Yerriboina, T.-G. Kim, N. Mahadev and J. G. Park. ECS Journal of Solid State Science and Technology, 9 (2020) 124004. DOI: 10.1149/2162-8777/abcf13 (Impact: 2.483)